Alice Kilgo: search on Z-Library

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1

Gold-Tin Solder Wetting Behavior for Package Lid Seals

Vianco, Paul T., Kilgo, Alice C., McKenzie, Bonnie M.

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 12.98 MB

english, 2018

2

Intermetallic compound layer formation between copper and hot-dipped 100In, 50In-50Sn, 100Sn, and 63Sn-37Pb coatings

Paul T. Vianco, Paul F. Hlava, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

1994

Language:

english

File:

PDF, 1.66 MB

english, 1994

3

Time-independent mechanical and physical properties of the ternary 95.5Sn-3.9Ag-0.6Cu solder

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

2003

Language:

english

File:

PDF, 592 KB

english, 2003

4

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II—Aged condition

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 3.36 MB

english, 2004

5

Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder—Part I: As-cast condition

Paul T. Vianco, Jerome A. Rejent, Alice C. Kilgo

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 1.58 MB

english, 2004

6

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

Edwin P. Lopez, Paul T. Vianco, Jerome A. Rejent, Carly George, Alice Kilgo

Journal:

Journal of Electronic Materials

Year:

2010

Language:

english

File:

PDF, 743 KB

english, 2010

7

Failure Analysis Techniques for Microsystems-Enabled Photovoltaics

Yang, Benjamin B., Cruz-Campa, Jose L., Haase, Gaddi S., Cole, Edward I., Tangyunyong, Paiboon, Resnick, Paul J., Kilgo, Alice C., Okandan, Murat, Nielson, Gregory N.

Journal:

IEEE Journal of Photovoltaics

Year:

2014

Language:

english

File:

PDF, 709 KB

english, 2014

8

Kinetics of Pb-rich Phase Particle Coarsening in Sn–Pb Solder Under Isothermal Annealing–cooling Rate Dependence

Vianco, Paul, Rejent, Jerome, Zender, Gary, Kilgo, Alice

Journal:

Journal of Materials Research

Year:

2005

Language:

english

File:

PDF, 3.17 MB

english, 2005

9

[IEEE 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Tampa, FL, USA (2013.06.16-2013.06.21)] 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Ultra-thin single crystal silicon modules capable of 450 W/kg and bending radii

Cruz-Campa, Jose L., Nielson, Gregory N., Okandan, Murat, Resnick, Paul J., Sanchez, Carlos A., Nguyen, Janet, Yang, Benjamin B., Kilgo, Alice C., Ford, Christine, Nelson, Jeff S.

Year:

2013

Language:

english

File:

PDF, 457 KB

english, 2013

10

Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders

Vianco, Paul, Rejent, Jerome, Kilgo, Alice, Martin, Joseph

Journal:

MRS Proceedings

Year:

2006

Language:

english

File:

PDF, 3.08 MB

english, 2006

11

Creep Behavior of a Sn-Ag-Bi Pb-Free Solder

Vianco, Paul, Rejent, Jerome, Grazier, Mark, Kilgo, Alice

Journal:

Year:

2012

Language:

english

File:

PDF, 1.16 MB

english, 2012

12

Detachment of the Retina

F. Phinizy Calhoun, Jr., Alice P. Kilgo and Elizabeth Mills

Journal:

AJN American Journal of Nursing

Year:

1953

Language:

english

File:

PDF, 1.99 MB

english, 1953

13

2. NURSING CARE

Kilgo, Alice P., Mills, Elizabeth

Journal:

AJN American Journal of Nursing

Year:

1953

File:

PDF, 211 KB

1953

14

[IEEE 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Tampa, FL, USA (2013.06.16-2013.06.21)] 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) - Reliability model development for photovoltaic connector lifetime prediction capabilities

Yang, Benjamin B., Sorensen, N. Robert, Burton, Patrick D., Taylor, Jason M., Kilgo, Alice C., Robinson, David G., Granata, Jennifer E.

Year:

2013

Language:

english

File:

PDF, 1.66 MB

english, 2013

15

The Interface Metallurgy of Soldered Interconnections for Electronics Packaging Applications

Susan, Donald, Vianco, Paul, Kilgo, Alice

Journal:

Microscopy and Microanalysis

Year:

2004

Language:

english

File:

PDF, 461 KB

english, 2004

16

Accelerated aging and thermal-mechanical fatigue modelling of Cu-plated through holes with partial solder filling

Susan, Donald F., Kilgo, Alice C., Neilsen, Michael K., Vianco, Paul T.

Journal:

International Journal of Materials and Structural Integrity

Year:

2008

Language:

english

File:

PDF, 1.71 MB

english, 2008

17

SPIE Proceedings [SPIE MOEMS-MEMS Micro & Nanofabrication - San Jose, CA (Saturday 22 January 2005)] Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV - Backside preparation and failure analysis for packaged microelectromechanical systems (MEMS)

Walraven, Jeremy A., Tanner, Danelle M., Ramesham, Rajeshuni, Cole, Jr., Edward I., Barr, David L., Anderson, Richard E., Kilgo, Alice, Maciel, John J., Morrison, Richard, Karabudak, Nafiz N.

Year:

2005

Language:

english

File:

PDF, 779 KB

english, 2005

18

SPIE Proceedings [SPIE Laser Damage Symposium XLII: Annual Symposium on Optical Materials for High Power Lasers - Boulder, Colorado (Sunday 26 September 2010)] Laser-Induced Damage in Optical Materials: 2010 - How to polish fused silica to obtain the surface damage threshold equals to the bulk damage threshold

Alley, Troy, Exarhos, Gregory J., Gruzdev, Vitaly E., Allard, Peter, Schuster, Rod, Menapace, Joseph A., Ristau, Detlev, Collier, David, Smith, Arlee V., Soileau, M. J., Do, Binh T., Kilgo, Alice C.

Year:

2010

Language:

english

File:

PDF, 1.34 MB

english, 2010

19

Effect of thermal annealing on microstructure evolution and mechanical behavior of an additive manufactured AlSi10Mg part

Yang, Pin, Rodriguez, Mark A., Deibler, Lisa A., Jared, Bradley H., Griego, James, Kilgo, Alice, Allen, Amy, Stefan, Daniel K.

Journal:

Journal of Materials Research

Year:

2018

Language:

english

File:

PDF, 1.20 MB

english, 2018

20

Time Independent Deformation of a Sn-Ag-Bi Pb-Free Solder: Stress–Strain Deformation and Yield Stress Properties

Vianco, Paul T., McKenzie, Bonnie B., Rejent, Jerome A., Grazier, J. Mark, Jaramillo, Celedonio E., Kilgo, Alice C.

Journal:

Journal of Electronic Materials

Year:

2019

Language:

english

File:

PDF, 2.80 MB

english, 2019